767506
Titanium
sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.995% trace metals basis
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About This Item
Empirical Formula (Hill Notation):
Ti
CAS Number:
Molecular Weight:
47.87
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
12352103
EC Number:
231-142-3
MDL number:
assay
99.995% trace metals basis
form
solid
autoignition temp.
860 °F
reaction suitability
core: titanium
resistivity
42.0 μΩ-cm, 20°C
diam. × thickness
2.00 in. × 0.25 in.
bp
3287 °C (lit.)
mp
1660 °C (lit.)
density
4.5 g/mL at 25 °C (lit.)
SMILES string
[Ti]
InChI
1S/Ti
InChI key
RTAQQCXQSZGOHL-UHFFFAOYSA-N
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
Storage Class
11 - Combustible Solids
wgk
nwg
flash_point_f
Not applicable
flash_point_c
Not applicable
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Kostantinidis, S.; et al.
The European Physical Journal - Applied Physics, 56, 24002/1-24002/1 (2011)
Helmersson; U.; et al.
Thin Solid Films, 513, 1-1 (2006)
A Kurbad et al.
International journal of computerized dentistry, 16(2), 125-141 (2013-08-13)
This article presents two novel options for lithium-disilicate restorations supported by single-tooth implants. By using a Ti-Base connector, hybrid abutments and hybrid abutment crowns can be fabricated for different implant systems. The latter option in particular is an interesting new