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About This Item
Linear Formula:
(H2NC6H4)2SO2
CAS Number:
Molecular Weight:
248.30
UNSPSC Code:
12162002
NACRES:
NA.23
PubChem Substance ID:
EC Number:
201-248-4
Beilstein/REAXYS Number:
788055
MDL number:
Quality Level
assay
97%
form
crystals
mp
175-177 °C (lit.)
SMILES string
Nc1ccc(cc1)S(=O)(=O)c2ccc(N)cc2
InChI
1S/C12H12N2O2S/c13-9-1-5-11(6-2-9)17(15,16)12-7-3-10(14)4-8-12/h1-8H,13-14H2
InChI key
MQJKPEGWNLWLTK-UHFFFAOYSA-N
General description
4-aminophenyl sulfone (DDS) is a diamine-based hardener that is used to cure epoxy-based resins.
Application
Tetrafunctional epoxy resins can be blended with DDS and can be thermally cured which can be used in oil field applications. DDS can also be used to cure iron oxide (Fe2O3) layer double hydroxide based epoxy that forms a flame retardant epoxy nanocomposites. It can also be used as a hardener to cure bisphenol A (DGEBA) for use in the fabrication of flame retardant epoxy/clay nanocomposites.
signalword
Danger
Hazard Classifications
Acute Tox. 4 Oral - Aquatic Chronic 2 - Repr. 1B - STOT RE 2 - STOT SE 2
target_organs
Blood, Blood,spleen,Liver
Storage Class
6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects
wgk
WGK 3
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
dust mask type N95 (US), Eyeshields, Gloves
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Glass transition dependence of ultrahigh strain rate response in amine cured epoxy resins.
Knorr Jr DB.
Polymer, 53(25), 5917-5923 (2012)
A novel high performance bismaleimide/diallyl bisphenol A (BMI/DBA)-epoxy interpenetrating network resin for rigid riser application.
Jena RK, et al.
Royal Society of Chemistry Advances, 5(97), 79888-79897 (2015)
Jaesung Seo et al.
Health and quality of life outcomes, 13, 138-138 (2015-09-05)
This paper aimed to employ subject matter experts (SMEs) to assess the extent to which the Korean version of the short-form of the OHIP (OHIP-14 K) is culturally valid and equivalent in Korean. We approached 17 bilingual Korean SMEs from


