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About This Item
Linear Formula:
NH2C(=NH)NHCN
CAS Number:
Molecular Weight:
84.08
UNSPSC Code:
41116107
NACRES:
NA.24
PubChem Substance ID:
MDL number:
Beilstein/REAXYS Number:
605637
grade
pharmaceutical primary standard
API family
metformin
manufacturer/tradename
USP
mp
208-211 °C (lit.)
application(s)
pharmaceutical (small molecule)
format
neat
SMILES string
NC(=N)NC#N
InChI
1S/C2H4N4/c3-1-6-2(4)5/h(H4,4,5,6)
InChI key
QGBSISYHAICWAH-UHFFFAOYSA-N
General description
This product is provided as delivered and specified by the issuing Pharmacopoeia. All information provided in support of this product, including SDS and any product information leaflets have been developed and issued under the Authority of the issuing Pharmacopoeia.For further information and support please go to the website of the issuing Pharmacopoeia.
Application
Metformin Related Compound A USP reference standard for use in specified quality tests and assays.
Also used to prepare standard stock, standard and system suitability solution during the assay and impurity analysis of Metformin Hydrochloride and Glipizide and Metformin Hydrochloride Tablets by using liquid chromatography in conjunction with UV detector.
Also used to prepare standard stock, standard and system suitability solution during the assay and impurity analysis of Metformin Hydrochloride and Glipizide and Metformin Hydrochloride Tablets by using liquid chromatography in conjunction with UV detector.
Analysis Note
These products are for test and assay use only. They are not meant for administration to humans or animals and cannot be used to diagnose, treat, or cure diseases of any kind.
Other Notes
Sales restrictions may apply.
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Storage Class
11 - Combustible Solids
flash_point_f
Not applicable
flash_point_c
Not applicable
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Glipizide and Metformin Hydrochloride Tablets
United States Pharmacopeia and National Formulary
United States Pharmacopeia, 32(4), 2116-2116 (2020)
Metformin Hydrochloride
United States Pharmacopeia and National Formulary
United States Pharmacopeia, 44(6), 2821-2821 (2020)
Changkyu Kim et al.
Nanoscale, 7(15), 6627-6635 (2015-03-21)
The realization of air-stable nanoparticles, well-formulated nanoinks, and conductive patterns based on copper is a great challenge in low-cost and large-area flexible printed electronics. This work reports the synthesis of a conductively interconnected copper structure via thermal sintering of copper