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Merck

348848

Titanium

foil, thickness 0.025 mm, 99.98% trace metals basis

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Fórmula empírica (notación de Hill):
Ti
Número CAS:
Peso molecular:
47.87
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
12141746
EC Number:
231-142-3
MDL number:
Servicio técnico
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Quality Level

assay

99.98% trace metals basis

form

foil

autoignition temp.

860 °F

composition

Ti

reaction suitability

core: titanium

resistivity

42.0 μΩ-cm, 20°C

thickness

0.025 mm

bp

3287 °C (lit.)

mp

1660 °C (lit.)

density

4.5 g/mL at 25 °C (lit.)

application(s)

battery manufacturing

SMILES string

[Ti]

InChI

1S/Ti

InChI key

RTAQQCXQSZGOHL-UHFFFAOYSA-N

General description

Ti has low thermal and electrical conductivity. It is highly corrosion-resistant and has a high strength to weight ratio. A few angstroms thick layer of titania on the surface of Ti products makes its corrosion resistant.5 Ti foils could be employed as a substrate to grow arrays of hematite nanorods by hydrothermal method. A study reports pressure less sintering of SiC pieces and single crystals to Ti foils at 1500oC. Ti foil may be applied as an interlayer, diffusion bonded during the self joining of Si3N4. Si3N4/Ti-foil/Si3N4.

Application

  • Medical Devices: Due to its biocompatibility, it is widely used in medical applications, such as in joint replacement implants, dental implants, and surgical instruments (Britannica).
  • Corrosion Resistance: Its resistance to corrosion by both water and chemical media leads to its use in chemical processing industries for equipment like heat exchangers and reactors (Royal Society of Chemistry).

Preparation Note

280 mg = 50 × 50 mm; 1.1 g = 100 × 100 mm


Clase de almacenamiento

11 - Combustible Solids

wgk

nwg

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Eyeshields, Gloves, type N95 (US)



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Joining of silicon nitride with a titanium foil interlayer
Lemus J and Drew RAL
Materials Science & Engineering. A, Structural Materials : Properties, Microstructure and Processing, 352, 169-178 (2003)
Bonding mechanism between silicon carbide and thin foils of reactive metals
Morozumi S, et al.
J. Mater. Sci., 20(11), 3976-3982 (1985)
Large-Scale Porous Hematite Nanorod Arrays: Direct Growth on Titanium Foil and Reversible Lithium Storage.
Song Y et al.
The Journal of Physical Chemistry C, 114(49), 21158-21164 (2010)