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제품정보 (DICE 배송 시 비용 별도)
Linear Formula:
C6H3(CO2H)3
CAS 번호:
Molecular Weight:
210.14
UNSPSC Code:
12352100
NACRES:
NA.22
PubChem Substance ID:
EC Number:
209-077-7
Beilstein/REAXYS Number:
2053080
MDL number:
Assay:
95%
Quality Level
assay
95%
greener alternative product characteristics
Design for Energy Efficiency
Learn more about the Principles of Green Chemistry.
sustainability
Greener Alternative Product
impurities
<5% acetic acid
mp
>300 °C (lit.)
functional group
carboxylic acid
greener alternative category
SMILES string
OC(=O)c1cc(cc(c1)C(O)=O)C(O)=O
InChI
1S/C9H6O6/c10-7(11)4-1-5(8(12)13)3-6(2-4)9(14)15/h1-3H,(H,10,11)(H,12,13)(H,14,15)
InChI key
QMKYBPDZANOJGF-UHFFFAOYSA-N
General description
We are committed to bringing you Greener Alternative Products, which adhere to one or more of The 12 Principles of Greener Chemistry. This product has been enhanced for energy efficiency. Find details here.
Trimesic acid (TMA), also known as 1,3,5-benzenetricarboxylic acid, has a self-organized 2D molecular network structure formed by intermolecular hydrogen bonds between the carboxylic acid residues in bulk crystals.
Application
TMA can be used in the synthesis of metal-organic frameworks (MOFs), which can be used as organic linkers potentially utilized in sensors.
저장 등급
11 - Combustible Solids
wgk
WGK 3
ppe
dust mask type N95 (US), Eyeshields, Gloves
문서
Metal-organic frameworks offer high surface area materials for alternative energy applications through simple synthetic strategies.
Solid-state self-assembly of a complex from 1, 3, 5-benzenetricarboxylic acid and 1, 3, 5-trihydroxybenzene: influence of strong O-H--O and C-H--O hydrogen bonds
Liu R, et al.
New. J. Chem., 25(7), 890-892 (2001)
A two-dimensional molecular network structure of trimesic acid prepared by adsorption-induced self-organization
Ishikawa Y, et al.
Chemical Communications (Cambridge, England), 3(22), 2652-2653 (2002)
Benign preparation of metal-organic frameworks of trimesic acid and Cu, Co or Ni for potential sensor applications
Sel K, et al.
Journal of Electronic Materials, 44(1), 136-143 (2015)