E19154
Ethylcyclohexane
≥99%
Synonyme(s) :
ECH
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A propos de cet article
Formule linéaire :
C6H11C2H5
Numéro CAS:
Poids moléculaire :
112.21
UNSPSC Code:
12352100
NACRES:
NA.22
PubChem Substance ID:
EC Number:
216-835-0
Beilstein/REAXYS Number:
1900337
MDL number:
Assay:
≥99%
Form:
liquid
Service technique
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Laissez-nous vous aidervapor pressure
25 mmHg ( 37.7 °C)
Quality Level
assay
≥99%
form
liquid
autoignition temp.
504 °F
expl. lim.
6.6 %
refractive index
n20/D 1.432 (lit.)
bp
130-132 °C (lit.)
mp
−111 °C (lit.)
density
0.788 g/mL at 25 °C (lit.)
SMILES string
CCC1CCCCC1
InChI
1S/C8H16/c1-2-8-6-4-3-5-7-8/h8H,2-7H2,1H3
InChI key
IIEWJVIFRVWJOD-UHFFFAOYSA-N
Application
Ethylcyclohexane can be used as:
- A model for alkyl-substituted cycloalkanes to study their rate coefficients of reaction with OH radicals and Cl atoms.
- A model for light hydrocarbons to investigate their catalytic cracking performance.
- An organic monomer precursor to synthesize organic-inorganic hybrid polymer thin films by plasma enhanced chemical vapor deposition.
signalword
Danger
hcodes
Hazard Classifications
Aquatic Acute 1 - Aquatic Chronic 2 - Asp. Tox. 1 - Flam. Liq. 2 - STOT SE 3
target_organs
Central nervous system
Classe de stockage
3 - Flammable liquids
wgk
WGK 3
flash_point_f
64.4 °F - closed cup
flash_point_c
18 °C - closed cup
ppe
Eyeshields, Faceshields, Gloves, type ABEK (EN14387) respirator filter
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Gas-phase rate coefficients for a series of alkyl cyclohexanes with OH radicals and Cl atoms.
Bejan IG, et al.
International Journal of Chemical Kinetics (2018)
A Fuangswasdi et al.
Water research, 41(6), 1343-1349 (2007-02-03)
Mixtures of anionic and cationic surfactants exhibit synergistic behavior as evidenced by low critical micelle concentrations (CMC) of the mixed system, increased surface activity, and improved detergency performance. The adsorption of a single-head anionic surfactant, sodium dodecyl sulfate (SDS), in
The characteristics of organic-inorganic hybrid low-k thin films by PECVD.
Cho SJ, et al.
Surface and Coatings Technology, 202(22-23), 5654-5658 (2008)