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この商品について
化学式:
NH2C(=NH)NHCN
CAS番号:
分子量:
84.08
UNSPSC Code:
41116107
NACRES:
NA.24
PubChem Substance ID:
MDL number:
Beilstein/REAXYS Number:
605637
grade
pharmaceutical primary standard
API family
metformin
manufacturer/tradename
USP
mp
208-211 °C (lit.)
application(s)
pharmaceutical (small molecule)
format
neat
SMILES string
NC(=N)NC#N
InChI
1S/C2H4N4/c3-1-6-2(4)5/h(H4,4,5,6)
InChI key
QGBSISYHAICWAH-UHFFFAOYSA-N
General description
この製品は薬局方標準品です。発行元の薬局方により製造・供給されています。MSDSを含む製品情報などの詳しい情報は、発行元の薬局方のウェブサイトよりご確認ください。
Application
Metformin Related Compound A USP reference standard for use in specified quality tests and assays.
Also used to prepare standard stock, standard and system suitability solution during the assay and impurity analysis of Metformin Hydrochloride and Glipizide and Metformin Hydrochloride Tablets by using liquid chromatography in conjunction with UV detector.
Also used to prepare standard stock, standard and system suitability solution during the assay and impurity analysis of Metformin Hydrochloride and Glipizide and Metformin Hydrochloride Tablets by using liquid chromatography in conjunction with UV detector.
Analysis Note
These products are for test and assay use only. They are not meant for administration to humans or animals and cannot be used to diagnose, treat, or cure diseases of any kind.
Other Notes
Sales restrictions may apply.
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保管分類
11 - Combustible Solids
flash_point_f
Not applicable
flash_point_c
Not applicable
Metformin Hydrochloride
United States Pharmacopeia and National Formulary
United States Pharmacopeia, 44(6), 2821-2821 (2020)
Glipizide and Metformin Hydrochloride Tablets
United States Pharmacopeia and National Formulary
United States Pharmacopeia, 32(4), 2116-2116 (2020)
Changkyu Kim et al.
Nanoscale, 7(15), 6627-6635 (2015-03-21)
The realization of air-stable nanoparticles, well-formulated nanoinks, and conductive patterns based on copper is a great challenge in low-cost and large-area flexible printed electronics. This work reports the synthesis of a conductively interconnected copper structure via thermal sintering of copper